Service Pack 1 for Windows 7 and Windows Server 2008 R2 coming February 22nd

February 10th, 2011 at 10:45 AM  2 Comments

Microsoft has officially announced that Service Pack 1 for Windows 7 and Windows Server 2008 R2 will be released to the general public on February 22, 2011.

Volume License customers, TechNet and MSDN subscribers will get access to the download on February 16. OEM and other Microsoft partners got access to the bits yesterday.

For server admins, one of the more interesting features of Service Pack 1 is Dynamic Memory. From the Windows Server Blog:

Our first new feature, Dynamic Memory, takes Windows Server’s Hyper-V feature to a whole new level. Dynamic Memory lets you increase virtual machine density with the resources you already have—without sacrificing performance or scalability. In our lab testing, with Windows 7 SP1 as the guest operating system in a Virtual Desktop Infrastructure (VDI) scenario, we have seen a 40% increase in density from Windows Server 2008 R2 RTM to SP1. We achieved this increase simply by enabling Dynamic Memory.

For desktop users, RemoteFX will be a boost for users who frequently RDP into their clients, or are running desktops in virtual machines.

RemoteFX is an exciting technology that lets you virtualize the Graphical Processing Unit (GPU) on the server side and deliver next-generation rich media and 3D user experiences for VDI.

IBM announces industry’s densest, fastest on-chip 32 nanometer dynamic memory

September 20th, 2009 at 6:17 PM  2 Comments

ibm-logoIBM has developed a prototype of what could become the industry’s smallest, densest, and fastest on-chip dynamic memory device, in the form of 32 nanometer silicon-on-insulator (SOI) technology, promising improvements in speed, power savings, and reliability for a wide range of products.

By insulating transistors against electrical leakage, IBM’s SOI technology is able to boast performance increases of up to 30 percent while reducing power consumption by 40 percent over conventional silicon technologies. This has allowed them to produce sample embedded dynamic random access memory (eDRAM) chips that have the smallest memory cell in the industry, while offering density, speed, and capacity surpassing that of conventional on-chip static random access memory (SRAM) in either 32 nanometer or 22 nanometer technologies, and closer to that of 15 nanometer SRAM technology. With latency and cycle times of less than 2 nanoseconds, IBM’s 32 nanometer SOI eDRAM is the fastest embedded memory announced to date.