As I stated in my previous post, I have left the world of BlackBerry and Microsoft Exchange behind and transitioned my e-mail, calendar, contacts, and mobile platform to Google Apps and Android. Doing so was no small decision, as my “day job” requires that I have access to all of these items and that they work in unison with each other, my desktop, my laptop, and that I have access to my data anywhere at any time.
I own an IT consulting firm, and as you can imagine, that means that I am not always in the office, and don’t always have connectivity available. With my BlackBerry, it was as simple as loading the Sprint SmartView software on my laptop (similar applications are provided by most carriers) and using my BlackBerry’s data connection. However, SmartView doesn’t work with the Samsung Moment, and Sprint has made the (poor) decision to do away with tethering or “Phone-As-Modem” options on their Simply Everything plans which are required plans for their smartphones. I speculate that their reason for doing away with tethering is an effort to drive customers to the increasing number of mobile broadband devices that they carry, including the new Novatel MiFi 2200 router, but I’ll save that gripe for another post.
Those of you who know me, know that I have been an avid BlackBerry proponent for many years. I held fast to the opinion that BlackBerry coupled with Microsoft Exchange was the solution for business mobile communications. Be it BlackBerry Enterprise Server or Microsoft ActiveSync, I held steadfast in my opinion that nothing could perform as well or better in maintaining perfect harmony between my desktop, my laptop, my phone, and anywhere access to my information. I am here to say, that era has ended. A moment of silence, please. Now that the mourning is over, let me tell you the changes I’ve made, how, and why.
First, let me say that I had not been looking to leave the BlackBerry/Exchange family, but I was holding out for a full screen BlackBerry with a physical keyboard, a slider if you will. Those of you who follow mobile devices closely, especially those who follow BlackBerry hardware, are well aware of the numerous design concept drawings, mock-ups, etc. of a BlackBerry slider that have been floating around for at least a year. Never revealing just exactly when we would see such a device, RIM has only been willing to confirm that several design options have been considered. This secrecy is nothing unusual among device manufacturers, but the lack of information and an opportunity provided by a competitor presents a precarious position, and, in this case, caused a long time RIM fan to jump ship.
Earlier this week I had the opportunity to join in on a discussion with Greg Huff, HP’s Chief Technologist for HP’s ProLiant servers team, as a followup to the HP ProLiant Tech Day and Web Jam event that we attended back in March. While the discussion was focused on some of the material that we had gone over back in March, a few points were raised that I wasn’t aware of. Points that, in my opinion, HP should be putting a little more emphasis on in their marketing and advertising. Primarily, the amount of HP’s intellectual property that makes its way into technologies that most probably aren’t aware of.
For example, we discussed some of the intellectual property (IP) that HP has had a hand in developing, and has licensed to manufacturers to be included in their products. As an example we discussed a series of network adapters made by a variety of hardware vendors that include some HP IP in their design. These adapters are sold in systems from just about every vendor, and are fully functional network adapters that have the same basic performance specs across the board. However, because HP participated in the development of the technology, there are some functions that are only available if that technology is in an HP product. So you take two different servers, one from HP and the other from another vendor, and both have the exact same NIC in them. The core functionality of the network interface is exactly the same on both systems, but the HP system could have capabilities that don’t show up at all on the other vendor’s system. Abilities such as being able to eliminate extraneous cabling by controlling data flow at the core level of the NIC itself. I asked Gregg about other examples of these core hardware differences, and while some of the details are out there in individual white papers, there isn’t a list that points out the differences across the hardware spectrum.
As a follow-up to this discussion, HP has presented us with an opportunity to participate in a Q&A session with their ProLiant G6 folks, and we would like to get some participation from you, our readers. So if there’s anything that you’ve ever wanted to know about the HP ProLiant G6 line, or any suggestions or concerns that you feel should be addressed, please feel free to submit them here. HP will collect your submissions and they could make it into an upcoming interview and blog series that HP plans to kick off soon.
Earlier this week we joined several other sites at HP’s Cupertino, California campus for HP’s Superdome Tech Day. One of the scheduled events focused on some of the configuration and management of an HP Superdome solution in an adaptive infrastructure. HP solutions architect Richard Warham took us through several scenarios including how to rapidly scale up an application server in the event of a sudden surge in transaction volumes, and how to maintain service availability in the event of a server failure.
HP Superdome, the name “Superdome” alone invokes a sense of something enormous, powerful, and coming from HP, one can only envision a system at the top end of the power and capability scale. In fact, that’s just what the HP Superdome systems aim to be. For the last decade, HP has developed the Superdome platform to provide mission critical solutions for datacenter environments where down time can not only be costly but disastrous. HP Superdome provides the uptime demanded by services like emergency call centers, major financial centers, and online ordering systems, as well as mission critical infrastructures for major corporations around the world.
Over the last decade, HP has developed the Superdome platform to provide mainframe performance and stability. According to a 2008 Dataquest Insight survey, the cost of downtime within large organizations (2,500+ users) has jumped from $40,000 in 2005 as the average cost per hour of downtime of mission critical business systems to $128,000 in 2008, an increase of 120%. These same companies reported that the amount of downtime they had experienced during the 2005-2008 time frame had also increased 69%. With statistics like that, it becomes painfully obvious that IT downtime downtime directly affects the bottom line. Throughout the growth of the HP Superdome platform, features like redundant cell board components, double chip spare memory, and hot swap I/O have been developed to provide resiliency and to prevent downtime, all with the goal of providing near perfect availability.
During their StorageWorks Tech Day 2009 event being held in Colorado, HP announced the details of several new additions that expand the HP Total Care solution line. HP Total Care provides a host of resources offered by HP Authorized Partners, and includes services, tips and tools such as financing, drivers & downloads, free online classes, support, and recycling, all focused on promoting growth and management resources to SMB’s.
“By investing in new IT solutions now, SMBs will be in a stronger position to seize growth opportunities and thrive as the economy rebounds,” said Kathy Chou, vice president, Worldwide Small and Midsize Business Strategy, HP. “With today’s announcement, HP continues to enrich its Total Care offerings to meet the evolving needs of our SMB customers.”
“AMI has surveyed thousands of SMBs in over a dozen countries over the last four quarters, and noted that the current economy has greatly changed the way they purchase technology products and services,” said Anil Miglani, senior vice president, AMI-Partners. “As we exit the global recession, SMBs will try to protect their existing technology investments while making new investments to grow their business and strengthen customer relationships. HP is well-prepared to help SMB customers achieve this balanced growth through its comprehensive Total Care portfolio.”
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September 24, 2009 :
By Shane Pitman ·
Category : News
During his keynote address at the Intel Developer Conference forum in San Francisco, David Perlmutter, Intel executive vice president and general manager, Intel Architecture Group, revealed a new a new optical cable technology that could eliminate the copper wiring traditionally used to connect many of today’s electronics and components. Codenamed “Light Peak,” this technology could vastly change the landscape of input output (I/O) performance on everything from connecting consumer electronic devices, to how we connect external devices to PC’s and servers.
Initially, Light Peak cables will be able to deliver 10GB/s of bandwidth (fast enough to transfer a full Blu-Ray movie in less than 30 seconds), with the potential ability to scale to 100GB/s over the next decade. Optical technology also allows for smaller connectors and longer, thinner, and more flexible cables than currently possible. Light Peak also has the ability to run multiple protocols simultaneously over a single cable, enabling the technology to connect devices such as peripherals, workstations, displays, disk drives, docking stations, and more.
Intel has unveiled their latest Core i7 processors for laptops, and also announced details of upcoming mobile technologies, at the Intel Developer Forum in San Francisco, California. During the keynote address by David (Dadi) Perlmutter, executive vice president and general manager, Intel Architecture Group, the newest Core i7 processors were presented as being focused towards the most demanding PC users who create digital video, play intense games or run compute-intensive business applications. These new quad core processors and chipset are based on Intel’s Nehalem platform, and include Intel’s Turbo Boost, and Hyper-Threading technologies.
“Staying connected on an increasingly broad array of mobile devices has become the most exciting and quickly evolving part of technology,” said Perlmutter. “Intel is delivering the total mobile experience on each device, offering different levels of performance and power in sleek form factors coupled with compatibility, a superior mobile Internet experience and embedded WiMAX wireless broadband. We’re truly taking mobility to the next level of cool.”
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September 20, 2009 :
By Shane Pitman ·
Category : News
IBM has developed a prototype of what could become the industry’s smallest, densest, and fastest on-chip dynamic memory device, in the form of 32 nanometer silicon-on-insulator (SOI) technology, promising improvements in speed, power savings, and reliability for a wide range of products.
By insulating transistors against electrical leakage, IBM’s SOI technology is able to boast performance increases of up to 30 percent while reducing power consumption by 40 percent over conventional silicon technologies. This has allowed them to produce sample embedded dynamic random access memory (eDRAM) chips that have the smallest memory cell in the industry, while offering density, speed, and capacity surpassing that of conventional on-chip static random access memory (SRAM) in either 32 nanometer or 22 nanometer technologies, and closer to that of 15 nanometer SRAM technology. With latency and cycle times of less than 2 nanoseconds, IBM’s 32 nanometer SOI eDRAM is the fastest embedded memory announced to date.
Silicon has been the standard material for semiconductor construction for decades, but that could soon change. While producing ever faster technologies, the physical dimensions of chips have decreased over the years, and engineers have known that they would eventually reach physical limitations in trying to make ever smaller and faster chips based on silicon. “We won’t be able to continue improving silicon by scaling it down for long,” says Tomas Palacios, assistant professor in the Department of Electrical Engineering and Computer Science at MIT. “It’s very difficult to make them a lot smaller.”
Of course silicon isn’t the end-all-be-all of transistor material when it comes to speed. “There are several semiconductor materials that offer better performance than silicon,” Palacios says. “The problem is, even though they allow for very fast transistors, they cannot compete with silicon in terms of integration and scalability.” Companies have spent decades and billions of dollars developing technologies based on silicon, and to make a total jump to another material would be neither practical nor profitable.
Marshalus: My poor doggies have been locked away in their houses almost nonstop since 7am, they're wild things now, no chance for me to sleep soon. #fb
10 Mar 2010
Marshalus: Waking up at 1am to let the dog out, then having to give them a bath because their covered in mud really sucks. My backyard is a swamp. #fb
09 Mar 2010
fowen: @dandahlberg@joshdi not sure what group you are in but I think Jake is impressed with the ASA series, just not so much with the SA series.
09 Mar 2010